ASMPT SEMI Solutions

Intelligent chips are transforming our world – ASMPT Semiconductor Solutions provides the technology for what comes next. ASMPT Semiconductor Solutions (ASMPT SEMI) is a world-leading provider of forward-looking solutions for advanced packaging and semiconductor assembly.

By integrating chips, systems, and technologies, We form the backbone of future intelligent applications in Artificial Intelligence, Smart Mobility, and Hyperconnectivity. This is how we Empower the Intelligence Revolution.

What We Do Our comprehensive portfolio spans the full semiconductor packaging process chain — from deposition and laser dicing to mainstream interconnect technologies and next generation advanced packaging, including wafer level packaging, thermocompression bonding, and hybrid bonding.

Designed for demanding applications, our solutions deliver higher performance, reliability, and more cost-efficiency across key industries.