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Job Description
- Drive end-to-end electrical architecture for space-constrained devices, leveraging advanced packaging technologies like System in Package (SIP) and rigid-flex to maximize density and minimize Z-height.
- Act as the technical linchpin, collaborating with mechanical, Radio Frequency (RF), sensors, and display teams to resolve physical layout collisions and foster architectural convergence.
- Lead data-driven trade-offs balancing size, performance, cost, and thermals to keep development moving while optimizing SoC integration for power and thermal efficiency.
- Guide New Technology Introductions (NTI) to integrate novel, market-differentiating hardware components into the final product design.
- Ensure design for manufacturability (DFM) by overseeing rapid prototyping and validation of early-stage systems, ensuring compact architectures can be reliably scaled for mass production.