Develop high-fidelity 3D electromagnetic models of device packages, transitions, and microwave cavities using Ansys High-Frequency Structure Simulator (HFSS) or CST Studio Suite.
Conduct high-frequency measurements using Vector Network Analyzer (VNAs) and Time Domain Reflectometer (TDRs) to characterize physical prototypes, in cryogenic set ups.
Lead efforts to "close the loop" by correlating empirical lab data with virtual 3D EM models to refine simulation models.
Interface with chip designers and packaging teams to provide design guidelines.
Perform analyses on package geometries to mitigate discontinuities, return loss, and crosstalk.

Electromagnetic Engineer, Superconducting Qubit Package Modeling

Job Description