<2026 Internship Program> Process Engineer Intern (Wire Bonding)

• To work with operation/maintenance to ensure production smoothly.
• To assist action confirmations with system monitors.
• To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator.

Job Qualification:

• Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures
• Bachelor's or Master's student in Material/Science/Electronic Engineering or related
• Available to work at least 3 days/week.
• Good verbal and written English communication skills
• MS Office or Programming skill
• Self-motivated, results oriented, willing and eager to learn, proactive attitude

More information about NXP in Greater China...

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