Senior Packaging Engineer, Silicon Photonics
Job Description
About Us:
nEye.ai, a well-funded optical switch startup, is poised to revolutionize the future of data centers. nEye’s MEMS-based silicon photonics optical circuit switches (OCS) eliminate critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units. The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability.
Job Overview:
This role is for a highly skilled and experienced Packaging Design Engineer to own bump-bond, die-attach, adhesive, and fiber-attach for our next-generation silicon photonics packaging solutions. You will be the designer of our product-critical packaging designs, ensuring high performance and exceptional reliability. You will own the details of the assembly, from the collaborative design of the electrical, optical and mechanical structures to process definition, with a focus on design for manufacture and design for reliability.
This is a hands-on technical position requiring a deep understanding of precision optical assembly. You will work closely with other packaging engineers, as well as integrated circuit (IC) design, mechanical, and reliability teams to create robust, manufacturable packaging solutions. Your expertise will be vital for pushing the boundaries of fiber-to-chip coupling efficiency, mechanical stability, and long-term product reliability. You will maintain the controlled documentation for every interface in the package — materials, surface preparations, critical process steps, thermal budgets, and the rationale for each — and defend those choices in design reviews with data. You define the design intent — geometries, materials, tolerances, and the rationale behind them — and partner with process engineers who develop the recipes and equipment settings to realize your designs in production.
About Us:
nEye.ai, a well-funded optical switch startup, is poised to revolutionize the future of data centers. nEye’s MEMS-based silicon photonics optical circuit switches (OCS) eliminate critical bottlenecks in AI processing by enabling direct optical connections among thousands of GPUs and memory units. The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design, offering hyperscale data centers enhanced performance, efficiency, and scalability.
Job Overview:
This role is for a highly skilled and experienced Packaging Design Engineer to own bump-bond, die-attach, adhesive, and fiber-attach for our next-generation silicon photonics packaging solutions. You will be the designer of our product-critical packaging designs, ensuring high performance and exceptional reliability. You will own the details of the assembly, from the collaborative design of the electrical, optical and mechanical structures to process definition, with a focus on design for manufacture and design for reliability.
This is a hands-on technical position requiring a deep understanding of precision optical assembly. You will work closely with other packaging engineers, as well as integrated circuit (IC) design, mechanical, and reliability teams to create robust, manufacturable packaging solutions. Your expertise will be vital for pushing the boundaries of fiber-to-chip coupling efficiency, mechanical stability, and long-term product reliability. You will maintain the controlled documentation for every interface in the package — materials, surface preparations, critical process steps, thermal budgets, and the rationale for each — and defend those choices in design reviews with data. You define the design intent — geometries, materials, tolerances, and the rationale behind them — and partner with process engineers who develop the recipes and equipment settings to realize your designs in production.