Master's Thesis: Modeling and Simulation of Wafer Bonding Process

Core Requirements:

• Possible fields of study: Microsystems Engineering, Electrical Engineering, Physics, Materials Science, Nanotechnology, Semiconductor Technology, or related disciplines.
• Enrolled student in Chemnitz, Mittweida or the surrounding area.
• Analytical Skills: Solid understanding of mechanics and wave propagation.
• Programming: Proficiency in Python for analytical modeling and data processing.
• Strong English and German reading and comprehension skills.
• An average grade of < 2 completes your profile.
  
  

Preferred Qualifications (Plus):

• FEM Software: Experience with COMSOL Multiphysics, ANSYS or a similar software.
• Domain Knowledge: Previous exposure to wafer bonding processes or semiconductor manufacturing technology.
• Scientific Writing: Ability to document complex technical results clearly in English or German.
• Machine Learning: Basic knowledge and demonstrated skills / awareness regarding surrogate models.