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Job Description
Job Summary
NXP Semiconductors is seeking a Physical Design Engineer (G2) with strong fundamentals in digital implementation to join our growing VLSI team. In this role, you will contribute to the implementation and signoff of complex SoC/IP blocks in advanced technology nodes, ensuring high-quality delivery aligned with NXP’s stringent PPA (Power, Performance, Area) and reliability standards.
Key Responsibilities
- Execute block-level physical design from synthesized netlist to GDSII:
- Floorplanning and power grid design
- Placement and optimization
- Clock Tree Synthesis (CTS)
- Routing and post-route optimization
- Drive timing convergence across MCMM scenarios in collaboration with STA teams
- Ensure design closure including:
- Setup/hold timing closure
- DRC/LVS clean signoff
- IR drop and electromigration (EM) compliance
- Debug and resolve:
- Congestion issues
- SI/crosstalk problems
- Functional and physical ECOs
- Collaborate cross-functionally with:
- RTL/design teams to improve QoR
- DFT teams for test readiness
- Packaging and full-chip integration teams
- Contribute to methodology improvements and automation through scripting
- Follow and enforce NXP design methodologies, quality and reliability standards
Required Qualifications
- Bachelor’s/Master’s degree in Electronics / Electrical Engineering / Microelectronics
- 3–5 years of experience in ASIC Physical Design
- Strong understanding of:
- Physical design flow (FP → P&R → Signoff)
- Static Timing Analysis fundamentals
- CMOS digital design basics
- Hands-on experience with industry EDA tools:
- Cadence (Innovus/Genus) or Synopsys (ICC2/Fusion Compiler, PrimeTime)
- Good scripting skills in Tcl, Python, or Shell
Preferred Qualifications
- Experience in advanced nodes (16nm and below)
- Knowledge of:
- Low-power design flows (UPF/CPF)
- Multi-voltage / multi-domain designs
- High-speed interfaces (PCIe, DDR, Automotive SerDes)
- Familiarity with physical verification tools (Calibre, Pegasus)