Job Description
Detailed Description
Performs tasks such as, but not limited to, the following:
- Models high-density I/O's on PCBs, packages, connectors and probe cards with respect to parameters such as reflections, bandwidth, and crosstalk
- Lead the design, development and implementation of technical solutions for complex projects, involving multiple domains. Participate in project planning and scheduling.
- Strong knowledge in simulation tools like Hspice, Sigrity, ADS, Ansys SIwave, HFSS 3D.
- Strong knowledge in Signal Integrity and Power Integrity fundamental concepts.
- Strong experience in Package and PCB modelling is required.
- Keep up to date with relevant industry knowledge and regulations
- Performs Transmission line & Via modelling and carry out experiments to validate modelling outcomes and methodologies.
- Should be able to analyze and review the layout files related to Signal integrity and Power Integrity problems.
- Should be able to provide practical solutions to PCB/Package design team based on simulation results and analysis.
- Conducting Simulation of memory interfaces for Board and Package and High Speed Serial IO interfaces for Board and Package.
- Perform decoupling capacitor optimization, Loop inductance analysis.
- May be a recognized expert (go to person) in one or more technical areas.
