Back to jobsKnowledge in wire bond diagram /netlist.
Working knowledge in logical net-listings, schematics usage, electrical and routing rules creation.
Good understanding & knowledge on Advanced Packaging architecture and semiconductor packaging process flow (Back Grinding, Dicing, Die Attach, Wire Bonding, Molding, P&P, Ball Attach, Trim & Form, Singulation).
Strong presentation skills with excellent networking skills.
Excellent English communication to work with a diverse cross-functional culture.
Willing to tackle tough problems and enjoy problem solving. Comfortable in large corporate environments and can work with multi-functional teams across geographies.