Back to jobsProficient in Cadence Allegro Package Designer (APD) or comparable & AutoCAD experience to design, view, edit or verify designs for optimization iterations and package sign-off.
Working knowledge in logical net-listings, schematics usage, electrical and routing rules creation.
Experience in designs utilizing blind, buried and micro vias would be advantageous.
Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues.
Good understanding on creating design manual, design rules, generation rules, drawings preparation and documentation.
Good understanding & knowledge on Advanced Packaging architecture and semiconductor packaging process flow (Back Grinding, Dicing, Die Attach, Wire Bonding, Moulding, P&P, Ball Attach, Trim & Form, Singulation).
Strong presentation skills with excellent networking skills.
Excellent English communication to work with a diverse cross-functional culture.