GE Vernova is a global energy company with over 130 years of experience solving global challenges. GE Vernova contributes to the energy transition by continuing to electrify the world while striving to decarbonize it. GE Vernova helps its customers power communities and provide the electricity essential for health, safety, and improved quality of life. GE Vernova employs more than 80,000 people in over 140 countries. GE Vernova's Grid Solutions business electrifies the world through advanced grid technologies and systems, enabling the transmission and distribution of energy from the point of generation to the point of consumption, and supporting a secure and decarbonized energy transition.

At its manufacturing facility in Aix-les-Bains, France, GE Vernova's Grid Solutions business designs, tests, and manufactures gas-insulated electrical substations for its national and international customers.

Reasons/Context for Recruitment:

• Acceleration of the digital design cycle: transition from prototype to industrialization of intelligent measurement systems.

• Desire to strengthen the synergy between electronic design (PCB) and the stringent mechanical constraints of high-voltage environments (vibration resistance, electromagnetic compatibility, thermal management).

• Need for integration and miniaturization of sensors and embedded electronic boards.

Missions/Tasks:

• Design and modeling of supports, enclosures, and mounting interfaces for electronic components in an industrial setting.

• Conducting space and thermal impact studies to ensure the reliability of electronic systems.

• Writing technical assembly documentation and participating in the definition of assembly procedures for mechatronic sub-assemblies.

• Creating prototypes (3D printing, quick wiring, enclosures, etc.) to validate ergonomics and physical integration on-site or on a test bench.

Specific skills required:

• Proficiency in 3D CAD and electronic CAD software (Creo, Catia, Altium, KiCAD, etc.)
• Skills in mechanics and mechatronics.

• Knowledge of electromagnetic compatibility (EMC) applied to electronic integration.

• Ability to understand the links between electrical constraints (signal path) and mechanical constraints (vibration, climate, seismic, IP, etc.)
• Knowledge of Product Lifecycle Management (PLM) such as Windchill is a plus.

Required qualities:

• Autonomous
• Technical curiosity
• Collaborative

Required level of study:

• Master's 1/2 - Start of work-study program