High Performance Packaging Integration Technologist

與我們攜手施展你的超能力！

準備好接受挑戰，探索更多可能性嗎? 我們跟你一樣希望精益求精，持續突破! 我們全球的夥伴熱衷於科技創新，透過我們醫藥保健、生命科學和電子科技業務的解決方案豐富人們的生活。讓我們一起環抱著熱情和夢想關懷我們的員工、客戶、病患和這個世界。這就是我們不斷尋找具備好奇心的新血加入的原因，與我們一起大膽想像各種可能。

我們在電子科技領域裡所做的一切，都是為了能成為眾多企業身後推動數位化生活的推手。我們致力於成為值得信賴的供應商，為電子、汽車和化妝品行業提供高科技材料、服務和特種化學品。我們培養了一個全球協作的組織，每位員工都擁有取勝的熱情、秉持客戶至上的態度、充滿好奇心且行事果決。我們齊心努力突破科學的極限，為客戶創造更多的可能性。

Job Title: High Performance Packaging (Advanced Packaging) Principle Integration Technologist

Role:

In this role you will be instrumental in developing our High Performance Packaging (Advanced Packaging) opportunity definition, ecosystem engagement strategy and program development. By connecting across key business unit partners and leveraging company core competencies, the candidate will drive business and product development from idea to proof of concept for transfer to high volume manufacturing.

The ideal candidate will combine a deep equipment, process and integration knowledge of High Performance Packaging technologies (including Wafer Level Packaging, Hybrid Bonding, Fusion bonding and adjacent technologies) with a vast ecosystem network of equipment suppliers, IDM/Foundry/Memory customers and consortia.

Responsibilities:

• Through technical expertise, identify and stay ahead of key High Performance Packaging (Advanced Packaging) technology inflection points and roadmaps
• Through industry/ecosystem connections continue to acquire in-depth strategic knowledge of customer and OEM roadmaps
• Transfer knowledge/educate peers (both laterally and up) on High Performance Packaging (Advanced Packaging) roadmaps
• Leverage industry knowledge to identify process/equipment/integration challenges
• Work across BU’s and CTO office to identify material solutions/developments to solve industry challenges
• Leverage industry network and connections to engage the ecosystem on collaborative development opportunities
• Leverage deep technical knowledge to ensure development programs are identifying and meeting industry standard datasets
• Ensure development programs are leveraging industry expertise to deliver relevant datasets in the timeliest manner

Who You Are:

Minimum Qualifications:

• MSc or higher (Mechanical Eng, Electrical Eng, Chem Eng or related engineering fields)
• 15+ years developing integration and process flows
• 15+ Years 300mm Process/ Equipment R&D hands on experience
  • • Advanced Packaging (300mm) Equipment Tool owner
    • Advanced Packaging Thin Films Dep/CMP/Bonding or Patterning Process development
• 10+ years of collaborative external business developments
  • • SOW (Scope of Work)/ POC (Proof of Concept)/DOE’s on equip/material definition
• 5 years experience of Adv Pkg Consortia engagements (IMEC, ITRI, A*, etc) including engagement model definition/ SOW development/ POC execution.

Preferred Qualifications:

• Demonstrated ability to work in highly ambiguous environments
• Demonstrated ability to work across matrixed organizations and deliver results
• Demonstrated ability to influence up to garner resources
• Entrepreneurial mindset
• Ability to condense complicated material down to key actionable items
• Ability to enroll resources to deliver success
• Demonstrated knowledge of customer/supplier interactions and how best to ‘mine’ the ‘why’s & how’s’ from those conversations
• Self-starter, ability to operate with little direction

Work Location: Based in Taiwan (Open to: Taipei, Hsinchu, Tainan, or Kaohsiung offices)

我們來自不同背景、視角與生活經歷，因對世界的好奇心而聚集在一起。我們深信，多元能夠催生卓越與創新，並持續強化我們在科學與技術領域的領導地位。我們致力於為每一個人創造機會，讓大家能依自己的節奏發展與成長。加入我們，一同打造一個充滿包容與歸屬感的文化，影響數百萬人的生活，攜手推動人類的進步！

立即申請，成為這個致力於激發探索精神、提升人類未來的團隊一員！