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Job Description
Process Engineer Required Skills: Knowledge of Microwave electronics and or semiconductor manufacturing is a plus. Automatic wire bonding and die attach experience is required. Capable of following manufacturing procedures and performing hands on assembly of manufacturing prototypes Capable of training operators in process operations. Knowledge in materials associated with Chip and Wire assemblies (silver epoxies, bonding Wire, Encapsulants). Responsible for: Duties include: Continuing improvement of MTAtesting / assembly process flow. Yield analysis and low yield events for Opto and RF parts. I nnovation and maintenance of the fixture and Auto Handler Boards. Capacity and Capability studies and analysis. Cost reduction programs. General Process / Product Sustaining activities. BoM/ Drawing / Router ownership for production released products. Job Complexity: Works on assignments that are difficult in nature, requiring judgment in resolving issues and making recommendations. Supervision : Normally receives minimal instructions on all work. Work under supervision.
