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Job Description
- Develop physical package substrate design of large form-factor package for ML high-performance computers (HPCs).
- Develop and implement the methodology and CAD flow for efficient substrate design and enhanced productivity.
- Manage and drive co-design initiatives across chip, package, and system levels, including securing production sign-off for package designs.
- Collaborate closely with signal integrity/power integrity (SI/PI), thermal, and mechanical engineering teams to refine and optimize product package designs, test vehicles, and mock-up designs for product feasibility.
- Define and document the requirements for the package substrate design and bill of materials (BOM).