Director of Technical Leader for Advanced PBCA and System Integration-Guadalajara, Mexico
Job Description
About Us
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Foxconn Industrial Internet has always adhered to the production and operation strategy of "Deeply cultivated in China and Deployed globally", played the role of a bridge and link between domestic and foreign dual circulation, and vigorously promoted the digital transformation of the entire ICT industry chain.
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After several years of development, it has become a leading enterprise in the global digital economy. It ranks second in the world in the electronic manufacturing service industry, and continues to contribute to the high-quality development of the digital economy.
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World's 2nd largest electronic manufacturing service industry
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30+ Fully automatic smart factories
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190,000+ Global Employees
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Fortune Global 500 - Ranked 22nd
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Global Views Monthly CSR & ESG Award - First Prize in the Category of Electronic Technology Industry
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Clarivate Top 100 Global Innovators - Awarded in 5 Consecutive Years
Houston Facility Locations:
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8303 Fallbrook Dr., Houston, TX 77064
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9625 Fallbrook Pines, Houston, TX 77064
• Lead the Development of Advanced PCBA / SI Mfg capabilities in the Mexico sites
• Collaborate and interact with customer technical team and Foxconn R&D to co-develop Test
Vehicle, Technical Spec/Checklist, Reliability Testing, DFM and Process for new assembly, rework
technology, component packaging and / or process material. Fostering strong and collaborative
relationships with clients and internal cross functional teams.
• Lead the Mfg technical team and work the labs at Mexico and global labs to perform all the process
and reliability evaluation regularly. .
• Support Foxconn central and other sites and BUs to share and develop new Advanced Mfg
Capabilities .
• Develop and mentor leaders to have good people skill and as well-rounded, high-potential technical
professionals.
Requirements:
1. Bachelor’s or Master’s degree in Engineering, Material Science, Statistics, or related fields.
2. Minimum of 10 years of Mfg Engineering and Process / Technology Development experience for
PCBA and SI and minimum 5 years in management position.
3. At least 5 years of experience in electronic manufacturing within a Contract Manufacturer (CM)
environment with a proven record.
4. Knowledge and experience of PCBA with large size BGA (> 80 mm x 80 mm), Co-Packaged
Optics, Thermal Compression Bonding, High speed connector / flying cable, and Liquid Cooling are
preferable,
5. Strong English communication skills (listening, speaking, reading, and writing) and excellent
interpersonal skill
6. Ability to lead projects from beginning to end and drive initiatives with a global team.
7. Ability to work under pressure.
8. Work location is in Mexico.