
Principal Process Engineer
Job Description
Key Responsibilities:
- Serve as the principal technical expert for wafer backgrind, thinning, and metallization processes in preparation for die assembly and final test.
- Provide deep technical guidance across wafer fabrication, back‑end assembly and packaging, final electrical testing, and reliability qualification.
- Support yield learning, defect reduction, and root cause investigations using semiconductor failure analysis techniques, advanced data analytics, and pattern recognition approaches.
- Lead post‑Fab process development, optimization, and sustainment to ensure manufacturability, robustness, yield, and cost competitiveness.
- Apply AI‑assisted data analysis, statistical learning, and automation tools to identify process trends, anomalies, and improvement opportunities in high‑volume manufacturing environments.
- Partner with Fab, Assembly, Test, Quality, Equipment, IT, and external suppliers to deploy data‑driven and AI‑enabled solutions that enhance process capability, cycle time, and operational efficiency.
- Own and execute high‑impact, self‑directed technical and manufacturing projects, ensuring alignment with business objectives, timelines, and quality standards.
- Anticipate technical risks, define mitigation strategies, and leverage predictive insights where applicable to proactively address manufacturing challenges.
- Communicate complex technical and data‑driven insights effectively to senior management and executive stakeholders, supporting informed strategic and operational decisions.
- Prepare and deliver high‑quality technical presentations and analytics‑based reports, translating advanced process and AI insights into clear business impact.
- Act as a trusted technical advisor and collaborative leader within a highly matrixed, global organization.
- Bachelor’s degree in Engineering, Materials Science, Physics, Data‑enabled Engineering, or a related discipline is required.
- Post‑graduate degree (Master’s or PhD) is an advantage.
- Minimum 10 years of relevant semiconductor or academic experience in wafer processing, post‑Fab manufacturing, assembly/test integration, or related research roles.
- Demonstrated experience applying data analytics, statistical methods, or AI‑assisted tools in semiconductor manufacturing, process engineering, or reliability analysis is strongly preferred.
- Deep technical expertise in wafer backgrind, thinning, metallization, and post‑Fab process integration.
- Strong working knowledge of AI‑enabled manufacturing analytics, including trend detection, process monitoring, yield learning, or decision‑support tools (coding expertise not mandatory).
- Advanced data analysis, problem‑solving, and executive‑level presentation skills.
- Excellent verbal and written communication skills, with the ability to influence technical and non‑technical stakeholders.
- Proven ability to work independently while driving results through cross‑functional and global collaboration.
More details about our company benefits can be found here: