Semiconductor Hermetic Packaging Process Engineer

Education: Bachelor’s degree in Electrical, Materials, Mechanical Engineering or Similar discipline Minimum 2 Years of Experience related to Manufacturing Engineering Disciplines (Product/Process/Operations/Quality) Experience in Mechanical Precision Alignment and/or Wire bonding Familiarity with Microsoft Office Suite of Products (Word, Excel, PowerPoint) Excellent written/oral communication, strong problem‑solving/root‑cause analysis, cross‑functional collaboration. Ability to obtain and maintain a Secret Security Clearance, which requires U.S. citizenship.Posted 6 days ago

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About Lockheed Martin

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