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Job Description
- Design, implement, and manage Integrated Circuit (IC) product bring-up, verification, and characterization programs for NPI, including ATE test programs, load boards, and probe cards using ATE platforms such as UFLEX or 93K.
- Collaborate with vendors and internal teams to engineer high-volume ATE manufacturing solutions tailored for advanced packaging.
- Execute product and Defective parts per million (DPPM) correlation between ATE and system-level environments for new products.
- Enhance test coverage and resolve various failure modes via troubleshooting on ATE and System Level Testing (SLT) systems.
- Direct production sustaining activities, including program upgrades, yield optimization, test time reduction, lot disposition, and Return Merchandise Authorization (RMA) analysis.