Job Title: Photonics Mechanical Engineer, Principal Position Overview: Technical lead supporting new product introductions from concept through production release. This individual will provide critical design input to RF and/or photonics product and design engineers for optimum, cost-effective mechanical solutions. This individual may be required to lead multiple product development projects in parallel to deliver opto-mechanical package and enclosure solutions (modules) on schedule for prototyping and manufacturing. Key Responsibilities: Technical lead for developing mechanical/manufacturing solutions in RF and photonics module and enclosure development. Work with internal Product Design, QA, Reliability, Supply chain and external suppliers to develop, apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, manufacturability, yield, and quality. Work with Design, Program Management and Material Planning to plan and establish Engineering Build Requirements and Qualification Build Requirements for new product introductions. Collaborate with vendors and internal engineering resources to establish and update design rules for packaging. Perform design reviews to ensure adherence to DFM guidelines. Establish and implement robust assembly processes internally and at contract manufacturers. Working with Quality organization, characterize failure modes and analyze as a function of packaging materials and processes. Troubleshoot packaging and assembly defects, then define and implement solutions. Design/Develop tooling for high volume, high mix processes. Establish application notes for new products.