Senior Technical Lead, New Product Engineering, Power Discrete/Module

Description

We are searching for a Power Discrete New Product Engineering Technical Leader (MTS) to drive all product-level engineering activities for Si, SiC, and GaN discrete/module in automotive and industrial applications at onsemi. This is a high-priority business growth area for the division, and we invite you to join us in this exciting career opportunity.

Job Roles and Responsibilities

The successful candidate will act as the single product‑level engineering owner, ensuring alignment between technical execution and business objectives across global NPD teams and functions to achieve performance, reliability, cost, and schedule targets.

1. Product‑Level Engineering Ownership

• Own product definitions and technical requirements for power discrete and power module products.
• Translate business, system, and customer requirements into clear, actionable product‑level engineering deliverables.
• Ensure consistency of product intent across die, package, and module implementations.
• Own and manage product‑level tradeoffs among performance, reliability, cost, manufacturability, and schedule.
• Identify and evaluate candidate module architectures, technologies, and packaging concepts for feasibility and risk.

2. Cross‑Functional Development Coordination

• Act as the primary integration and alignment point between TD, PE, packaging, test, reliability, quality, supply chain, and manufacturing teams.
• Drive alignment on interfaces, dependencies, deliverables, and milestones across organizations.
• Review and provide technical oversight on module design, electrical‑thermal analysis, structural simulation, and module design verification.
• Identify execution gaps, conflicts, and dependencies, and facilitate resolution through appropriate technical owners.
• Enable timely, decision‑ready outcomes without directly owning detailed die or package design authority.
• Coordinate system‑level electrical, thermal, and mechanical modeling to validate product performance.

3. Execution Governance & Risk Management

• Own and maintain product‑level risk registers covering design, reliability, qualification, and manufacturing risks.
• Drive mitigation plans, track execution status, and ensure risk visibility at the program level.
• Lead product design reviews, execution checkpoints, and qualification readiness reviews.
• Ensure adherence to NPD governance, gate requirements, and engineering best known methods (BKMs).

4. Problem Solving, Escalation & Task Force Leadership

• Act as the product‑level owner for complex technical and execution issues.
• Lead cross‑functional task forces to address critical design, qualification, reliability, or yield challenges.
• Drive structured problem solving and root‑cause analysis at the product level.
• Manage technical escalations by clearly framing issues, risks, options, and recommended paths forward for leadership decision‑making.

5. Qualification, Reliability & Release Readiness

• Own product‑level qualification strategy, ensuring alignment with automotive, industrial, and customer requirements.
• Coordinate with reliability, FA, and PE teams to assess qualification data and product‑level impact.
• Ensure issues are properly dispositioned with clear containment, corrective actions, and documented learning.
• Drive incorporation of lessons learned into future programs and BKMs.

6. Executive Reporting & Stakeholder Communication

• Provide clear, concise executive‑level reporting on product status, risks, qualification readiness, and recovery plans.
• Translate complex technical challenges into decision‑ready summaries for leadership forums.
• Consolidate cross‑functional inputs into aligned product‑level messaging with clear accountability and timelines.

Qualifications

• Master’s degree in electrical engineering, Materials Science, or related field.
• 10+ years of experience in power semiconductor product development (power discrete and/or modules; Si-IGBT / SiC MOSFETs preferred).
• Strong understanding of module packaging, thermal management, interconnects, and reliability fundamentals.
• Understanding of Design CAD and simulation tools 
• Proven ability to lead product‑level execution without direct design authority.
• Strong cross‑functional leadership, communication, and executive‑level presentation skills.