Staff, Semiconductor System Level Simulation Engineer

ON Semiconductor is seeking a self-driven and motivated professional to join their Corporate R & D modeling and simulation team, As a senior advanced semiconductor system level integration simulation engineer, you will have the opportunities to support new package and system integration development and new product design, assembly and process, quality and reliability, and customers in worldwide.

The successful candidate will have the opportunity to:

• Do system level integration (cooling system) simulation
• Do electrical-thermal-mechanical interaction for ISG chiplet 3D integration and next generation break-through power module
• CFD for Liquid Cooling Simulation/Immerse Cooling simulation
• Do analysis and correlation of modeling results to measured data
• Develop and maintain the state of art system integration, electrical-thermo-mechanical modeling methodology to improve the modeling work efficiency and accuracy
• Setup and maintain the HW/SW environment for electrical-thermo-mechanical modeling
• Provide support to other electrical-thermo-mechanical modeling users in company
• Innovation of new technology through simulation
• Develop the state of art simulation methodology such as AI and machine learning algorithm, probability and optimization algorithm

• PhD degree in Physics, Mechanical Engineering, Computational Mechanics, Solid Mechanics or Materials 
• knowledge and skills of system level cooling simulation
• knowledge of electrical-thermo-mechanical modeling
• Experience and skills in CFD and liquid cooling
• Knowledge and experience of CAD concepts and Solid works
• Familiar with semiconductor packaging and system integration
• Familiar with material electrical, thermal and mechanical properties
• Strong knowledge of problem analysis and diagnosis technique
• Familiar with package test and analysis, quality assurance, and reliability methods
• Ability to perform model correlation to empirical measurement
• Familiar with the Unix/Linux operating system
• Familiar with FEA software ANSYS Fluent, IcePak, mechanical.& multiphysics
• Strong English communication capability
• Strong learning capability
• Good team player