
Senior Lab Technician (Advanced Rework, Cable Assembly & Test)
Job Description
Description
What you will do
- Perform PCB assembly, soldering, and rework on multilayer boards with fine-pitch SMT, QFN/QFP, BGA, and MOSFET packages.
- Execute BGA rework (remove/reball/replace) using controlled thermal profiles, preheat methods, and microscope inspection.
- Rework thermal-pad power devices with proper solder wetting, heat control, and workmanship quality.
- Build prototype cables and wire harnesses from drawings and work instructions (cut, strip, crimp, solder, terminate, label, and strain-relieve).
- Validate cable assemblies through continuity and pinout checks, and additional verification methods as required.
- Set up and execute electronic test procedures for prototypes using DMMs, oscilloscopes, power supplies, electronic loads, and test fixtures.
- Record test results, compare to acceptance criteria, document failures, and support debug/failure isolation with engineering.
- Operate and maintain 3D printer equipment (FDM/SLA as applicable) to produce fixtures, tools, and prototype parts.
- Prepare, organize, and stage parts kits based on BOM and revision-controlled build requirements.
- Maintain accurate rework, test, and parts traceability records.
- Enforce lab organization standards, ESD controls, labeling discipline, and workstation readiness.
Who you are and What you bring
- 4+ years of experience in electronics lab, prototype, or advanced electronics assembly/rework.
- Demonstrated experience with fine-pitch SMT soldering and BGA rework.
- Proven experience soldering/reworking power packages, including MOSFETs.
- Hands-on experience with prototype cable/harness assembly and verification against schematics/pinout documentation.
- Hands-on experience executing electronic test plans and accurately documenting results.
- Minimum working expertise with IPC-A-610 Class 2 workmanship criteria, including inspection and accept/reject decisions.
- Ability to read schematics, assembly drawings, wiring diagrams, and BOMs.
- Strong organizational skills and attention to detail in parts kitting and lab workflow.
Preferred Qualifications
- Current or previous IPC certifications: J-STD-001, IPC-A-610, IPC-7711/7721, IPC/WHMA-A-620.
- Experience with X-ray-assisted BGA verification or external inspection workflows.
Work Environment
- Engineering lab environment requiring frequent microscope-based, fine-pitch hand assembly.
- Cross-functional collaboration with electrical, mechanical, and test engineering teams.
- Ability to handle and move light lab equipment and materials as needed.