Mechanical Engineering, Principal

Principal Packaging Engineer Job Description: Support new package design and development by providing direction to application and design engineers an optimum cost effective packaging solutions as well as provide thermal design and analysis services for IC package and system level physical designs. Working with other teams, establish and verify the reliability testing requirements for new package designs and processes to guarantee reliable products. Define assembly process, troubleshoot and support IC packaging defects. Provide supplier benchmarking and tracking data to drive backend technology roadmap. Assist in new product introduction management. Characterize failure modes, and analyze as a function of packaging materials and processes. Drive back-end process development for improved reliability, DFM, DFT, and short cycle-time with effective in-line controls and SPC. Provide Thermal Application Notes for company’s new packages. Provide thermal design solutions such as desired air flow, size, proximity of components, and PCB layer count specifications, and heat sinks at the system level.