Associate Engineer - Process (Wire Bond & Die Attach)

Responsible for sustaining & improving the Die Attach & Wire Bond Process. Overall knowledge on electronics manufacturing and must be able to collect and analyze data in order to create engineering reports for New products and regular production. Monitor and maintain Assembly yield within KPI target. Key involvement in improving the systems to bring down scrap rate due to process excursions. Initiate process improvements through effective evaluations of test/yield data and manufacturing defects and make adjustments to process equipment accordingly. Program, troubleshoot and maintain manufacturing process equipment as required to meet the required yield target. Support engineering initiatives in evaluating: solders, epoxies, new equipment (installations) and recommend solutions both tactically and strategically. Develop Manufacturing Work Instructions and production routes along with Engineering change orders implementation when applicable.