Cleanroom Assembler

The Assembler will be responsible for the electrical/mechanical assembly and testing of products and associated components in a cleanroom environment. He or she will ensure that all products and components meet established specifications per standard operating procedures and/or mandated customer requirements. 

Key Responsibilities:

• Operating manual wire bonding and other cleanroom equipment: Setting up, calibrating, and operating manual wire bonders to perform ball and or wedge bonds with meticulous control. 

• Precision wire bonding and assembly: Carefully manipulate and position the work holder under the bond head, creating the first bond, forming the wire loop, and creating the second bond. This requires excellent hand-eye coordination and precision under a microscope. 

• Process parameter adjustment: Adjusting bonding parameters (e.g., bonding force, power, temperature, time, ball size, and height) as needed. 

• Quality control and inspection: Inspecting components and wire bonds under a microscope to ensure they meet quality standards and specifications. Identifying and troubleshooting defects like damaged components, missing traces, wire breaks, golf balls, or non-sticking bonds. 

• Equipment maintenance and troubleshooting: Performing routine maintenance on manual wire bonding machines, troubleshooting minor equipment malfunctions, and reporting more complex issues to the appropriate personnel. 

• Cleanroom protocols and safety: Adhering to strict cleanroom procedures, electrostatic discharge (ESD) safety protocols, and company policies to maintain a clean and safe work environment. 

• Collaboration: Working closely with engineers, quality assurance technicians, and other assembly team members to ensure smooth production flow and high-quality output.

• Flexibility to be trained in multiple processes. 

• Utilize excellent electro-mechanical assembly skills to build, assemble, and test products. 

• Familiarity with FOD prevention and management. 

Qualifications and Skills:

• Education: High school diploma or equivalent, often coupled with vocational training or an associate degree in electronics or a related technical field. 

• Experience: Previous experience working in a manufacturing or cleanroom environment is highly desirable. Operating manual wire ball and/or wedge bonding equipment, and substrate and microchip mounting. 

• Technical skills: Strong manual dexterity, hand-eye coordination, strong attention to detail, and the ability to work with precision tools and microscopes are crucial. Familiarity with manual bonding techniques (e.g., ball bonding, wedge bonding, ribbon bonding) and an understanding of different wire materials (e.g., gold, copper, aluminum) and their properties is a plus. Experience with bond pull testers and other inspection tools may also be a plus. 

• Soft skills: Attention to detail, problem-solving skills, patience, focus, and the ability to follow detailed instructions are paramount. Good written and verbal communication skills are also important for effective collaboration and documentation.