Back to jobsResponsible for the development of materials required for OSAT Package Technology Development
Expertise in understanding semiconductor package materials, equipment and processes and have an established wide network of suppliers and contacts in the industry.
Need to work closely with development teams to develop the most profitable packaging solutions with right material selection.
Evaluate and select materials for packaging, focusing on their compatibility with the packaging technology, while considering cost constraints.
Knowledge and experience in managing die to package interactions.
Drive cost reduction programs and yield improvement programs
Identifying industry packaging trends, working with the Business Units to develop the required materials.
Liaise with materials and equipment suppliers, understand and influence roadmaps and narrow down packaging solutions & drive competitive analysis.
Able to quickly become acquainted with new topics and build lasting relationships with the Cross-functional teams and external counterparts.
Knowledge in materials characterization and analysis
General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
Good program management skills.