Automatic/Manual Wire Bonding Operator

Automatic Wire Bonding Operator Job Description This role will be an assembly operator working with Automatic wire bonding equipment. Responsibilities: Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction. Operate and set-up Automatic Gold wire/ribbon bonders (Palomar 8000, H+K 820 systems or F K Delvotec) per micro-circuit layout drawing s Operator is responsible for proper wire formation, bond appearance and bond strength. Flexibility to be trained in multiple Microelectronics processes that involve ball wedge wire bonding Capable of performing bond pull/die shear and plotting SPC with data Familiarity of the use of plasma cleaning and other surface preparation for semiconductors and substrates Requires significant attention to detail for production activities and documentation to maintain compliance with MIL-STD 883 requirements Familiarity with FOD prevention and management Familiar with ESD controls