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Job Description
- Develop next-generation packaging breakthroughs and qualify high-performance foundry solutions.
- Drive the development of advanced test macro features and execute engineering plans for next-generation package architectures.
- Identify packaging risks and document technical assessments to guide the definition of critical test vehicles.
- Define and implement design for X (DFx) (design for manufacturing (DFM), design for reliability (DFR), and design for testing (DFT)) methodologies tailored specifically for advanced packaging technologies.
- Collaborate with internal teams, foundries, Outsourced Assembly and Test (OSATs), and suppliers to deliver production-ready chip package solutions through execution of shared engineering plans.