Job Description Summary

The Lead Process Engineer will play a critical role in the development, optimization, and scaling of manufacturing processes for SiC/GaN power modules. This position partners closely with design engineering, operations, quality, and supply chain teams to lead rapid prototyping, improve process capability, increase manufacturing efficiency, reduce waste, and support the successful transition of products from development into production.

This role is highly hands-on and requires deep experience in cleanroom-based electronics manufacturing, power module assembly, test methods, and lean process improvement. The ideal candidate is a strong technical leader who can identify process gaps, solve complex manufacturing problems, drive measurable improvements in safety, quality, delivery, and cost, and collaborate across functions to build robust, scalable processes that meet customer and business requirements.

Job Description

Key Responsibilities

• Lead SiC/GaN power module prototyping, assembly, and test activities in a cleanroom manufacturing environment, with a strong focus on process repeatability and production readiness
• Drive process development, process optimization, and continuous improvement initiatives to improve yield, throughput, cycle time, quality, and manufacturability
• Identify process bottlenecks, variation drivers, and waste across manufacturing flows, and implement corrective and preventive actions
• Apply lean manufacturing principles and problem-solving methods to improve safety, quality, delivery, and cost performance
• Lead root cause investigations on product and process issues and implement sustainable corrective actions to prevent recurrence
• Troubleshoot existing SiC power module products and manufacturing processes, identify failure mechanisms, and improve process capability
• Evaluate new materials, process parameters, tooling, and manufacturing methods to improve product performance, reliability, and ease of manufacture
• Support qualification activities for power semiconductors, materials, assembly processes, and test methods
• Develop, refine, and standardize manufacturing methods to support consistent execution from prototype through production transition
• Perform and interpret acceptance testing, including pass/fail analysis, trend review, and out-of-range condition assessment
• Conduct failure analysis on defective components and assemblies using destructive and non-destructive techniques to drive process learning and corrective action
• Operate and support process equipment such as die bonders, wire bonders, stencil printers, reflow/soldering systems, plasma cleaners, and ovens
• Program and optimize automated assembly tools, including bonders, dispensers, and pick-and-place systems, to improve consistency, repeatability, and efficiency
• Use advanced test and inspection equipment such as acoustic microscopy (CSAM), electrical curve tracers, pull-shear testers, and other characterization tools to assess product and process performance
• Measure and analyze components and assemblies to identify variation, failure mechanisms, and opportunities to improve process robustness
• Maintain and improve bills of materials (BOMs), process travelers, reference documents, work instructions, and test/process instructions to ensure clear standard work and manufacturing discipline
• Establish and sustain process documentation that supports training, repeatability, traceability, and production control
• Communicate technical status, process risks, improvement opportunities, and recommendations clearly to management and cross-functional stakeholders
• Train, mentor, and support technicians and assemblers to ensure safe, standardized, high-quality, and on-time execution
• Partner with sustaining, electrical, quality, manufacturing, and supply chain teams to ensure products meet customer requirements, derived technical requirements, and manufacturing readiness expectations
• Champion a culture of lean manufacturing, standard work, visual management, and continuous improvement across module development and assembly activities

Required Qualifications

Education

• Bachelor’s or Master’s degree in Engineering or a related technical field

Experience

• Minimum of 2 years of electronics manufacturing or process engineering experience in a cleanroom environment

Technical Qualifications

• Experience troubleshooting manufacturing, assembly, or process issues in a cleanroom environment
• Demonstrated experience driving process improvement, waste reduction, yield improvement, or cycle time reduction
• Working knowledge of equipment such as die bonders, wire bonders, stencil printers, soldering/reflow systems, and related assembly tools
• Experience with electronic test, inspection, and troubleshooting techniques to the component level
• Understanding of materials used in power module or electronics assembly, including:
  • varieties of solder preforms and solder paste
  • conductive and non-conductive adhesives
  • conductors and dielectrics
  • varieties of silicone potting materials
• Familiarity with cleanroom operating protocols and maintenance requirements
• Knowledge of lean manufacturing principles, standard work, root cause problem solving, and continuous improvement methods
• Ability to work in a cleanroom environment for extended periods of time while wearing required cleanroom attire

Preferred Qualifications

• Experience with SiC and/or GaN power modules
• Experience in power electronics packaging, semiconductor assembly, or advanced electronics manufacturing
• Experience supporting prototype builds, new product introduction (NPI), production ramp, or production transition
• Background in failure analysis, process characterization, qualification testing, or manufacturing yield improvement
• Experience programming or optimizing automated assembly equipment
• Demonstrated ability to lead technical work, influence cross-functional teams, and drive measurable process improvements
• Experience applying lean tools such as root cause analysis, standard work, visual management, process flow improvement, or defect reduction methods

Work Environment

This role requires hands-on work in a Class 10,000 cleanroom environment for extended periods. Required attire may include full cleanroom gowning, hair net, face mask, and other cleanroom PPE as applicable.

Additional Information

GE will only employ individuals who are legally authorized to work in the United States for this opening. Any offer of employment is conditioned upon the successful completion of a background investigation and drug screen.

This role requires access to U.S. export-controlled information. Therefore, employment will be contingent upon the ability to prove that you meet the status of a U.S. Person as one of the following: U.S. lawful permanent resident, U.S. Citizen, have been granted asylee or refugee status (i.e., a protected individual under the Immigration and Naturalization Act, 8 U.S.C. 1324b(a)(3)).

Additional Information