Job Description
As a Die / Clip Attach Technical Expert, you will be responsible for developing and implementing competitive technical solutions across semiconductor manufacturing processes, including Pre-Assembly, Die Bond, Wire Bond, Mold, and related areas.
You will play a key role in driving equipment strategy, introducing advanced technologies, resolving complex technical challenges, and enhancing manufacturing performance in terms of cost, quality, and capability.
This role requires strong technical expertise, project leadership, and close collaboration with cross-functional and international teams to support factory objectives and future package R&D roadmaps.
What You Will Do
Equipment & Technology Strategy
Define and drive equipment strategies aligned with factory and package R&D roadmaps
Evaluate and select new equipment technologies for manufacturing processes
Lead equipment introduction and qualification projects
Process Improvement & Technical Leadership
Solve complex and chronic technical issues in manufacturing
Drive improvement projects to enhance productivity, process capability, quality, and cost efficiency
Develop and maintain process standards and design rules
Benchmarking & Best Practices
Conduct cross-site benchmarking activities
Implement best practices across manufacturing sites
Scout and evaluate state-of-the-art technologies and industry solutions
Project Management & Collaboration
Lead technical projects involving cross-functional and international teams
Prepare technical reports, capability studies, and roadmaps
Work closely with R&D, production, quality, and engineering teams
Industry & Market Awareness
Stay updated on the latest semiconductor equipment and process technologies
Build and maintain strong industry networks with suppliers and technology partners
What You Will Need
Bachelor’s or master’s degree in engineering or a related discipline
Minimum 10 years of experience in semiconductor manufacturing and process engineering
Strong technical expertise in process and/or equipment engineering within semiconductor assembly operations
Proven experience in equipment selection, qualification, optimization, and technology introduction
Strong analytical thinking with excellent troubleshooting and problem-solving capabilities
Ability to work independently and drive improvement initiatives proactively
Strong communication and presentation skills with the ability to engage stakeholders effectively
Experience leading technical and cross-functional projects in a manufacturing environment
Strong leadership, influencing, and stakeholder management skills
Detail-oriented with a structured and systematic working approach
Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.
D&I Statement
As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.
In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.