Job Description
To contribute in advancing high‑precision semiconductor production by applying technical skills in back‑end assembly test operation.
- Perform specific back-end semiconductor manufacturing functions in the production of semiconductor devices
- Operate various equipment in performing functions such as wafer scribe and break, die sort, die attach, lead bonding and seal, test, or mark and pack
- Graduate of a 2-year Technical course or Senior High School, or completed at least 2 years in college
More details about our company benefits can be found here:
