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Job Description
- Perform high-quality, precision micro-soldering and rework on multi-layer Printed Circuit Boards (PCBs), including managing surface-mount technology (SMT), Ball Grid Arrays (BGAs), 01005 components, and fine-pitch connectors.
- Disassemble and reassemble phone devices without damaging sensitive internal components (e.g., flexible printed circuits (FPCs), OLED screens, under-display fingerprint sensors, and battery thermal pads).
- Utilize schematics, board layout software, and test equipment (e.g., oscilloscopes, digital multimeters, DC power supplies) to diagnose hardware failures, short circuits, or component degradation.
- Execute post-rework testing protocols to ensure cellular, Wi-Fi, camera, audio, and power management systems are fully functional.
- Maintain accurate logs of modifications, rework history, and failure analysis. Keep the ESD-safe (Electrostatic Discharge) workstation and lab tools calibrated and clean.