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Silicon Quality and Reliability Engineer, Google Cloud
Posted 2 weeks ago
Job Description
- Perform the electrical and physical failure analysis on Central Processing Unit/Tensor Processing Unit (CPU/TPU) devices from prototype stages through manufacturing.
- Utilize advanced hardware and software techniques, such as Emission Microscope (EMMI) and Optical Beam Induced Resistance Change (OBIRCH), to localize defects within reasoning and memory blocks.
- Execute destructive techniques including delayering, cross-sectioning, and high-resolution imaging (e.g., Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Focused Ion Beam (FIB)) to visualize and identify physical defects.
- Partner with design, product, and foundry teams to interpret failure data and implement actions for design or process improvements.
- Generate Failure Analysis (FA) reports and develop novel workflows tailored for advanced technology nodes and three-dimensional (3D) packaging architectures.