Job Description
About ITT:
ITT Inc. (NYSE: ITT) is a diversified global leading manufacturer of highly engineered critical components and customized technology solutions serving the flow, aerospace and defense, transportation, industrial, and energy markets. Through operational execution, innovation, and disciplined capital deployment, including strategic acquisitions such as SPX FLOW, ITT partners with its customers to deliver enduring solutions to the key industries that underpin our modern way of life.
Headquartered in Stamford, Connecticut, ITT has a market cap of roughly $20 billion and employs more than 15,000 people across 40 countries and serves customers in approximately 125 countries. Following the acquisition of SPX FLOW, the company is expected to generate $5.4 billion in annual revenue.
Our businesses are organized in three distinct segments, each based around our core engineering DNA:
Flow Technologies: A global leader in, providing a broad portfolio of pumps, valves, mixing and agitation equipment, heat transfer, homogenizers, separation, water and wastewater treatment, and engineered process solutions.Our leading brands include the iconic Goulds Pumps (with more than 175 years of history), Anhydro, APV, Bornemann, Bran+Luebbe, C’treat, Engineered Valves, Gerstenberg Schröder, Goulds Pumps, Habonim, Johnson Pump, Lightnin, Philadelphia, Plenty, PRO Cast, Rheinhütte, Seital Separation, Stelzer, Svanehøj, Tigerholm, Uutechnic, VIDAR, Waukesha Cherry-Burrell.
Motion Technologies: A global leader in brake pads (ICE and electrified brake pads) and shock absorbers (energy absorption solutions) for transportation applications. Our leading brands include Friction Technologies, KONI and Axtone.
Connect and Control Technologies: A leader in critical applications for the aerospace, defense and industrial markets, including harsh environment connectors and control components. Our leading brands include ITT Cannon, Enidine, Aerospace Controls and kSARIA.
Position Summary
The Plater in the Electroplating Lab performs production plating operations on high‑precision RF connector components while maintaining proper chemical bath conditions. This role combines hands‑on plating with routine wet chemistry control to ensure consistent coating quality and compliance with aerospace and NADCAP requirements.
Essential Responsibilities
- Perform electroplating operations on small, precision components (e.g., contacts, connector parts) using processes such as gold and nickel plating
- Prepare parts for plating including cleaning, masking, racking, and fixturing
- Operate and monitor plating baths, maintaining parameters such as temperature, pH, and current density (ASF)
- Conduct basic wet chemistry checks (e.g., titrations, pH) and make routine chemical additions per specifications
- Inspect plated parts for coverage, thickness, and defects; identify and address basic process issues
- Maintain production records, bath logs, and lot traceability in accordance with NADCAP and quality requirements
- Follow all safety, environmental, and chemical handling procedures
Position Requirements
- High school diploma or equivalent required
- 1–3 years of electroplating or metal finishing experience in a production environment preferred
- Working knowledge of plating processes and basic bath chemistry control
- Ability to follow detailed procedures in a regulated (AS9100/NADCAP) environment
- Strong attention to detail and ability to work with small components
- Basic math and documentation skills
