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Job Description
- Develop, characterize, document, and scale manufacturing processes for the packaging of quantum computing devices.
- Operate, maintain, and troubleshoot key manufacturing equipment.
- Lead Vendor management (Failure Analysis/Root Cause Corrective Action (RCCA), improve yield and throughput, manage custom workflows, etc.).
- Implement and improve internal production processes (including wire bonding, work instructions/procedures, design and build fixtures/jigs, inspections, data hygiene, automation, technician training).
- Lead root cause analysis investigations for manufacturing failures and implement effective corrective and preventive actions.