Principal Application Engineer - Semiconductor Advanced Package

At Henkel, you’ll be part of an organization that’s shaping the future through innovation, sustainability and collaboration. With our trusted brands like Persil®, ‘all®, Loctite®, Snuggle®, and Schwarzkopf® and our cutting-edge technologies, you’ll have countless opportunities to explore new paths and grow. This position is with our Adhesive Technologies business unit – where we empower our people to transform industries and provide our customers with a competitive advantage through adhesives, sealants and functional coatings. Dare to learn new skills, advance in your career and make an impact at Henkel. What you´ll do You will be the technical lead helping customers successfully adopt Henkel’s advanced packaging materials. Your work directly impacts performance and reliability of next-generation semiconductor packaging technologies. Serve as the technical lead for Henkel’s advanced semiconductor packaging materials. Work directly with customers to optimize wafer or panel-level encapsulation and molding processes. Troubleshoot complex material and process issues for both developmental and commercial products. Ensure successful product adoption by delivering clear, measurable value to customers. Solve technology-specific challenges across product lines through innovative application development and material characterization. Collaborate closely with R D, sales, and product teams to translate customer needs into technical solutions.